BGA-936UA BGA Rework System
High Efficiency is the ultimate goal in our constant
pursue of perfection. Possessing fine heating element with
1000W upper hot air injection and ultra large IR bottom
heating system, 936UA offers excellent efficiency in
soldering and desoldering performance. Versatile clampers
is specially designed for various P.C.B. from mobile phone
to server field.
Reliability of 936UA guarantees the quality and stable
yield rate. The use of New Fuzzy Industrial Microprocessor
and Aviation Industrial Precision Linear Mechanism
brings more accurate and reliable result. Precise and
clear Different Color Alignment System makes alignment
trustworthy.
User-Friendly design with integrated operation interface
brings working pleasure to operators. No need for extra
equipment or air-supply, AC power itself is sufficient.
Within 2 hours of training, operator could understand and
operate our intuitive operation controller with ease for it is
that user friendly.
SMD-928S Hot Plate for BGA/SMD Replacement
Simple, Fast and Reliable Hot Plate
Best choice for BGA Chip Replacement Processing. Combining with fixture, it is simple and fast to replace solder ball on chips within 3 minutes.
Excellent preheat effect for BGA chip before actual replacement work.
Built-in advanced plate-type heater: convenient and effective solution for the various soldering and desoldering work on SMD and BGA chips.
Optimum for PC Board preheating, multi-varied small soldering production and general maintenance on small/middle-size PC Board.
PID Precision Temperature Control System
Temperature precision is ± 1ºC
More accurate and stable temperature display.
With timer display unit to achieve the best soldering result.
Outstanding Safety Device: Upper cover completely protects users from any burning damage.
BGA Reballing Fixture
World No.1 fast and convenient solution for BGA Chip Replacement work.
It can replace various types of BGA, μBGA, and CSP.
High precision aluminum alloy structure, durable, light and efficient.
Fast and convenient to reflow solder balls on the BGA chips, one cycle only needs 30~90 seconds.